Diagnostic toolbox

Cleaning process building and maintenance require to measure many of different parameters. Here you can find the most frequently used test methods and instruments for measuring all around the cleaning process.
We can offer majority of these tests and help our clients to solve cleaning challenges effectivelly. 

Toolbox for cleaning process development and maintenance

Methods and instruments in this group help to make cleaning process effective, powerfull and with perfect result. Diagnostic methods help to build a new cleaning process and to maintain its stability. Test methods for cleanlinnes help to determine future assembly reliability. 
 

Wash bath concentration

Concentration is one of the main parameters, determining the dissolving speed of flux residues. Concentration can vary by selective evaporation (water/organic) and a drag-over if the bath is not thoroughly mixed. 

Wash bath NVR (Non Volatile Residues)

Cleaner dissolves flux residues and becomes saturated. There are also some filtration options to slow down this process. It is important to know how much residue there is in the cleaner. Saturated cleaner cannot dissolve and can cause white residues, or can still dissolve more flux residues, but the rinsing process cannot run well.
Due to the difference of boiling point water, organic compounds of cleaner and dissolved flux residues, it is possible to use a standard evaporation test to determine the saturation grade.

Rinse bath ionic cleanliness

Concentration of ions in the rinse water is important for determining the final cleanliness of the assemblies as well as proper maintenance of ion exchange filters of deionized water refreshing control. All our machines for assembly cleaning have a water conductivity sensor contamination included. 

Rinse bath non-ionic cleanliness

We have a non-ionic contamination sensor, OCS (Organic Carbon Sensor) which monitors the amount of organic impurities. It can monitor the function of active carbon filters in closed-loop rinsing systems. It can also monitor the final non-ionic cleanliness in final rinsing stage. 
It can be used to monitor the organic carbon content of waste water from process. Reading can be calibrated to COD or TOC values important for waste water plant control.

AOI VERINAS

This automatic optical diagnostic test system is dedicated for measuring rest contamination under chip components on the PBT Glass Test Board. 
It is a first ever system which enables to get precise, numerical data on cleaning efficiency under components.
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PBT Glass Test Board

PBT Glass Test Board is an easy to use, precise test vehicle. It is targeted for visual measuring of flux residues under components after cleaning. It is a re-usable tool, thus a non-expensive one.
It was developed to shorten and make easier the Phase 1 of cleaning process or other studies for process characterization.
PBT Glass Test Board can be also used for long-term stability monitoring of qualified cleaning process.

ROSE – Resistivity of Solder Extract

Although this method is not any more accepted for process qualification, it can still give valuable data to unpopulated boards or leaded assemblies. We can offer such measurements and can use this instrument for suitable task in process characterization.

SIR – Surface Resistance Measuring

Surface resistance measuring is the most important method for determining chances of the process to supply reliable assemblies. High surface resistance prevent creep currents and dendrite growth.
We can offer the SIR test for process characterization, validation of changes or process qualification.

Ion chromatography

Measuring specific ion concentration in the test solution which was in contact with a cleaned assembly for 1h at 80°C offers quite precise data. Even if it cannot give a good/bad decision about the cleanliness, it is a very good analytical tool. It can determine the reason of impurities, this helps to take efficient measures to modify the cleaning process. 

Surface tension test

Measuring of surface tension is important for determining overall cleanliness of the surface after cleaning. Any organic contamination on the surface may cause problems during next coating, deposition processes or bonding. 

Ultrasonic intensity measuring

For ultrasonic cleaning of electronic assemblies. There is a fear about cavitation damage of fine structures. Therefore, exact measuring of energy in the cleaning bath is crucial for the protection of possible risk.

Testing visible flux residues

Visual checking is a basic method for determining the cleanliness of the assembly. While today, SMT assemblies have a lot of directly invisible critical areas, it is necessary to apply dedicated optical methods. 

Testing mechanical cleanliness

Mechanical cleanliness is an important parameter not only in mechanical assemblies, but also for electronics. Insulated or conductive particles , both can negatively affect the function.
Standardized methods have been introduced for evaluation of such pollutants (foreign object debris).
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