Designed for demanding or large assemblies, low-standoff components and tough residues where cleaning quality is the primary decision factor. Excellent cleaning performance of most complex assemblies.
Clean high-density, large-format and standard PCBAs on one configurable platform. Linear spray technology, hot-air knife drying and adaptive rinse control support repeatable results for demanding electronics production.
Stage the next batch while the current cycle runs to increase equipment utilisation and reduce handling. Closed process loops and traceability help manage utilities, chemistry and make process optimisation easier.
Application: High-density & standard SMD assemblies
Capacity: High volume
Contamination solubility: Easy to hard
Match cleaning performance and batch capacity to your product mix
TWINGO prioritises cleaning performance for large, dense or difficult assemblies. COMBO prioritises loading density for standard and mid-size PCBAs or mechanical parts. Both use the same HyperSWASH platform utilising spray bars and hot-air knives. The machine can be also exchanged for application-specific custom clamping available for specialised requirements.
Designed for demanding or large assemblies, low-standoff components and tough residues where cleaning quality is the primary decision factor. Excellent cleaning performance of most complex assemblies.
Buffered handling keeps production moving
The pushcart separates loading from the cleaning cycle: operators can prepare the next batch offline while HyperSWASH is running. This reduces idle time, avoids repeated manual lifting and lets the loading station sit where it best fits the production area. Fast, safe, ergonomic. Utilising AGV/AMR-based automation, this system supports work in lights-out manufacturing environments.
The operator exchanges the pushcart manually. PCBAs can be loaded into TWINGO frames or COMBO baskets manually, or by a robot when dedicated fixtures are used. The pushcart allows the PCBA loading station to be placed next to the machine or at another convenient location in the production area.
HyperSWASH automatically transfers the prepared batch from the pushcart into the chamber. The pushcart can be moved by an underride AMR to a dedicated PCBA loading station, creating a buffered workflow between the cleaning machine and the production line.
Consistent Cleaning Results Across Every Batch
HyperSWASH combines linear spray cleaning and hot-air knife drying in one chamber. Compared with inline cleaning systems, the batch platform offers a smaller footprint and individually configurable wash, rinse and drying phases while reducing chemistry, DI-water and energy use through closed process loops. Exchangeable nozzle sets support standard and application-specific tooling.
Separate washing, rinsing and drying functions stabilise the process and control consumption
Dedicated plumbing and filtration reduce cross-contamination, while closed loops help manage chemistry and DI-water demand.
Closed-loop washing combines a water-based cleaning agent with continuous filtration. The process can be matched to compatible chemistries from leading suppliers, helping maintain cleaning performance while controlling chemical consumption.
Chemical Stop limits chemistry carryover, foam and filter load. The first rinse removes remaining contamination; the final rinse delivers the required surface condition. Closed-loop DI-water regeneration helps reduce fresh-water demand.
The linear hot-air knife combines droplet removal with evaporation. Effective drying prepares PCBAs for downstream coating, bonding, inspection or packaging and reduces the risk of residual moisture reaching the next process.
Maintain the target concentration without relying on time consuming manual sampling and top-up.
Measurement, adaptive dosing and level control keep the bath within its process window, reduce routine handling and record actual concentration values.
Provides real-time concentration measurement for compatible ZESTRON cleaning agents, independent of flux loading, with values integrated into HyperSWASH control.
Monitors and analyses the concentration of compatible KYZEN and other cleaning chemistries in real time, with integration into the machine control software.
Uses measured concentration and level data with the PBT dosing-mixing unit to maintain the target chemistry. This supports stable results, less manual handling and documented process control.
Advanced monitoring provides data for process control and maintenance planning . Controlled recipes and traceability help maintain validated settings across products and shifts.
Continuous rinse monitoring adjusts rinse time to the cleanliness target and the condition of the DI-water loop. Closed-loop or open-loop operation can be selected to suit the validated process.
Optional TOC-based monitoring complements conductivity by detecting non-ionic organic residues that can affect coating, bonding, insulation resistance and long-term reliability.
Recipe control, detailed programming, maintenance support, user permissions and configurable MES integration help preserve validated parameters and provide the records customers require.
